Dimensity 9000+, the newest flagship model from MediaTek, launched by a chipmaker company based in Taiwan. This chipset is a successor to the flagship Dimensity 9000 processor, which was introduced in December 2021. The key changes to the silicon’s CPU result in a claimed performance improvement of about 5% in the new chipset, which outperforms the previous Dimensity 9000 chipset.
A higher-clocked prime core of the chipset, which the firm claims would increase performance, is the main distinction between the Dimensity 9000+ and Dimensity 9000. A 3GHz Cortex X2 core of the Dimensity 9000 is replaced with a fresh 3.2GHz Cortex X2 core.
Compared to the earlier chip, the rest of the chipset is unchanged. Even though MediaTek hasn’t officially confirmed the A510 cores’ clock speeds for the Dimensity 9000+, we still have three Cortex A710 cores running at 2.85GHz and 4 Cortex A510 cores at 1.8GHz.
The Arm Mali-G710 MC10 GPU is built into both chipsets, which support up to 180Hz at Full HD+ resolution and 144 Hz at WQHD+ resolution. The 5th Gen 590 AI processing unit and compatibility for LPDDR5X RAM up to 7500Mbps are still available.
Further supported specifications include Wi-Fi 6E 22 (BW160), Wireless Stereo Audio, Bluetooth 5.3 with BLE auto-ready, and Beidou-B1C GNSS compatibility. According to MediaTek, the Dimensity 9000+ chipset would perform 10% better on the GPU and 5% better on the CPU when compared to the Dimensity 9000. Even though this is a little but substantial distinction, don’t anticipate a performance gap between phones running on the Dimensity 9000+ and 9000.
Other features of the silicon remain the same, including the ARM’s v9 Processor architecture with a 4nanometers octa-core process, incorporated LPDDR5X RAM with 8MB L3 Central processing unit and 6MB system cache, the MediaTek Imagiq 790, an 18-bit HDR-ISP which supports 320 Megapixel and corresponding triple camera 18-bit Full HD video recording, and the MediaTek MiraVision 790, that also supports the latest 144Hz WQHD+ displays.
Wi-Fi 6E, New Bluetooth 5.3, New GNSS with Beidou III-B1C, and a built-in 5G modem that uses 3CC Carrier Aggregation to increase sub-6GHz speed to 7Gbps downlink are all supported.
For improved performance in AI multimedia, gaming, cameras, and other areas, the SoC is additionally supported by the 5th Gen MediaTek APU 590. The Artificial Intelligence enhanced variable-rate shading innovation, ray-tracing development tools, and other improvements are made possible by the MediaTek HyperEngine 5.0, which is for various gaming upgrades.
According to the manufacturer, the latest Dimensity 9000+ chip will be available in phones starting in Q3 2022. However, it did not mention which phone manufacturers will utilize the chipset. It is still unknown whether the Dimensity 9000+ will overtake Qualcomm’s Snapdragon 8-series chipsets as the most popular in flagship Android devices across companies in the coming months.